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개최일시 : 2016년 03월 22일 화요일 11:00 ~ 12:30

개최장소 : 제 3공학관 C616호

세미나 제목 : New Developments in 3D IC Design and CAD Research at the GTCAD Laboratory

발표초록 :

This talk starts with an overview of the four generations of 3D ICs and their status: package-on-package (Gen1), 2.5D ICs with silicon interposers (Gen2), 3D ICs with on-chip through-silicon-vias (Gen3), and monolithic 3D ICs (Gen4). We then present our design and CAD research on Gen3 and Gen4 3D ICs. We first show how much power reduction we achieved with 3D IC implementations of a commercial-grade 8-core processor. We also discuss the RTL-to-GDSII tools and sign-off analyzers developed along the way, which for the first time is shown to outperform commercial 2D CAD tools. Second, we present our 2-tier 3D IC test chip that features 64 general-purpose processor cores and SRAM. This is arguably the first general-purpose many-core 3D processor ever developed in academia and fully tested using real applications. Lastly, we show our recent studies on the multi-physics (= thermo-electro-mechanical) reliability issues for 3D ICs.

강연자 : Sung Kyu Lim / Georgia Institute of Technology

초청자 : 전기전자공학과 교수 고태국,허견