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Title
A paper by a Prof. Chae's Team Is Accepted for ISSCC 2022 Subject to “Miniaturized Wireless Neural Implant”
Date
2021.12.02
Writer
전기전자공학부
게시글 내용


Mr. Changuk Lee, who works as a PhD student in Prof. Youngcheol Chae's team, has developed a miniaturized wireless neural implant, together with the team of Prof. Jong-Hyun Ahn, and has been approved by the International Solid-State Circuits Conference (ISSCC) in 2022. The silicon chip makes it possible to achieve wide bandwidth and high energy transfer efficiency even without precise alignment between implants and external devices. The results clearly demonstrate new technology in the wireless neural implants and showed superior performance over conventional technologies.

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